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如題:1 z, Q& ^+ ?2 U1 V6 j* \
各位大大們:
; c5 x% ?6 p+ I D4 s請教一下 Number of bonded IOBs: 563 out of 440 127% (*) : `; d$ r, ~0 L b9 N5 L' j9 r& p0 u, D, e
我的IOB超出範圍出現以下錯誤..該如何解決啊??
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ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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ERROR:Map:115 - The design is too large to fit the device. Please check the1 e- c3 |% N/ |4 l( {# J
Design Summary section to see which resource requirement for your design, x9 {' A( B( T: R# t. ~* I3 [
exceeds the resources available in the device. In particular check the9 p" T, _; G% E
non-slice resources since the slice counts may reflect the early termination
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NOTE: An NCD file will still be generated to allow you to examine the mapped
$ o3 `" c* i) L8 A: Z6 G- c design. This file is intended for evaluation use only, and will not process0 ^! E- F3 i+ K. ]; U: M
successfully through PAR.- m# u! A" G, v( T! N& @* }
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ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.% R4 O# ?$ Z$ i1 V3 C
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