ISE的問題...請教前輩們

mclaren_18

   如題:
4 J5 S7 h6 b" s. H2 G各位大大們:
+ x& p2 [) s( o1 }6 A請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
# W" a- U& z$ y6 D$ z8 g我的IOB超出範圍出現以下錯誤..該如何解決啊??

' K9 V) d4 e: U, s* QERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
( S  v* H' X/ F6 y* X6 i
ERROR:Map:115 - The design is too large to fit the device.  Please check the
& m4 I6 C6 P7 r' \& I/ _   Design Summary section to see which resource requirement for your design
2 ^4 Z1 \# g: P+ |% l* S   exceeds the resources available in the device.  In particular check the
0 l4 ?. H& i0 P2 {   non-slice resources since the slice counts may reflect the early termination
' }2 F$ |$ v2 d4 R, S: M   of the flow.

   NOTE:  An NCD file will still be generated to allow you to examine the mapped
4 H( u* @/ ?. b7 p   design.  This file is intended for evaluation use only, and will not process
   successfully through PAR.
4 \% \5 X, \5 B; H4 ]
) K$ i& t% \) N# @/ a# zERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

6 Z2 H6 e% x: {' d7 K; e% x謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
* Y5 ~  N/ T5 o換較大的 package or 減少 IO 使用數量!