ISE的問題...請教前輩們

mclaren_18

   如題:
各位大大們:
  s* B1 D2 `+ B. l請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
7 V5 h* n9 F- L$ l9 ^, X+ K; j: P, P我的IOB超出範圍出現以下錯誤..該如何解決啊??

ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
9 K9 K8 n0 a3 |
ERROR:Map:115 - The design is too large to fit the device.  Please check the
   Design Summary section to see which resource requirement for your design
   exceeds the resources available in the device.  In particular check the
   non-slice resources since the slice counts may reflect the early termination
   of the flow.
& Q5 S7 z% e& D2 g' \
   NOTE:  An NCD file will still be generated to allow you to examine the mapped
   design.  This file is intended for evaluation use only, and will not process
" u2 s* P  f4 P+ ?5 z- ?   successfully through PAR.
* R* k( t$ e7 l/ V1 S
ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
7 Y9 H2 w) w6 [7 v1 d  q% d& M1 G
* ~, C3 i2 w  p. h) j7 P3 o謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
換較大的 package or 減少 IO 使用數量!