ISE的問題...請教前輩們

mclaren_18

   如題:
# w3 n$ W) }1 U/ R$ R; C8 D各位大大們:
請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
我的IOB超出範圍出現以下錯誤..該如何解決啊??

ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
4 Q; R2 H: `3 t& o1 K
ERROR:Map:115 - The design is too large to fit the device.  Please check the
: R0 v. d- y7 f! ~% h6 e$ K   Design Summary section to see which resource requirement for your design
   exceeds the resources available in the device.  In particular check the
   non-slice resources since the slice counts may reflect the early termination
# G; b  A# a/ L! e   of the flow.
9 P; c  }8 E7 K# e
2 C8 q3 ]/ C8 P   NOTE:  An NCD file will still be generated to allow you to examine the mapped
8 p. M# I3 y! i   design.  This file is intended for evaluation use only, and will not process
   successfully through PAR.

ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

3 \8 P% F) a$ R9 m/ l1 F6 r謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
換較大的 package or 減少 IO 使用數量!