ISE的問題...請教前輩們

mclaren_18

   如題:
各位大大們:
) R7 C, }* E9 @4 }2 X# y請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
" F8 g# n* f$ ?3 Y9 C我的IOB超出範圍出現以下錯誤..該如何解決啊??
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7 B; `  H3 g2 Q0 r2 V/ AERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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ERROR:Map:115 - The design is too large to fit the device.  Please check the
" [5 N! x& F  W) ?0 A0 v/ X   Design Summary section to see which resource requirement for your design
7 S+ {& H% I3 |7 _   exceeds the resources available in the device.  In particular check the
   non-slice resources since the slice counts may reflect the early termination
6 Q  s, |0 {! J4 A8 r; F   of the flow.
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5 V8 k* w0 h3 V. L# r0 }% S   NOTE:  An NCD file will still be generated to allow you to examine the mapped
" o5 |: ?6 \. }   design.  This file is intended for evaluation use only, and will not process
   successfully through PAR.
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ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
換較大的 package or 減少 IO 使用數量!