ISE的問題...請教前輩們

mclaren_18

   如題:
2 ]! G# j) v0 _6 X3 n各位大大們:
. |* e6 N& L6 I3 n5 s請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
. Q2 u; `8 ^& q/ `* ]1 x- M: M我的IOB超出範圍出現以下錯誤..該如何解決啊??

. J$ `+ C* a& }! k9 @% c' T0 G5 o# gERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

0 v3 a  k3 e/ ]7 U# O$ V$ J: vERROR:Map:115 - The design is too large to fit the device.  Please check the
   Design Summary section to see which resource requirement for your design
8 ]8 O3 X" t" k3 _* x3 Z! r   exceeds the resources available in the device.  In particular check the
   non-slice resources since the slice counts may reflect the early termination
# W' ^1 E6 Z* k) Z: a1 i   of the flow.
! z: o1 s: U7 X: G
   NOTE:  An NCD file will still be generated to allow you to examine the mapped
% J# R  {5 g% B   design.  This file is intended for evaluation use only, and will not process
0 B4 O7 r7 U; u- w: V   successfully through PAR.
) T# R; T! P$ O0 \
ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
; R6 ^# a# L' R, u/ Q6 {
謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
換較大的 package or 減少 IO 使用數量!