ISE的問題...請教前輩們

mclaren_18

   如題:
( V7 A) r! l  O% n( a各位大大們:
請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
我的IOB超出範圍出現以下錯誤..該如何解決啊??

ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
. \* |8 R9 C' V$ e
- S+ E5 ?6 ^& G1 ]4 L) h' ~+ dERROR:Map:115 - The design is too large to fit the device.  Please check the
* D( |. S* _9 O   Design Summary section to see which resource requirement for your design
! q1 ]- z. ~- o. y" _& e1 x  [' f   exceeds the resources available in the device.  In particular check the
   non-slice resources since the slice counts may reflect the early termination
   of the flow.

8 h7 ~, U% S% }( x4 f" W   NOTE:  An NCD file will still be generated to allow you to examine the mapped
   design.  This file is intended for evaluation use only, and will not process
   successfully through PAR.
& g7 f- }- Q+ o7 g6 x
ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

" q! ]+ M/ P4 f- F( f謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
換較大的 package or 減少 IO 使用數量!