ISE的問題...請教前輩們

mclaren_18

   如題:
3 d4 E+ F2 a9 m; [1 i各位大大們:
* G- X/ |1 v; u# T7 V請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
我的IOB超出範圍出現以下錯誤..該如何解決啊??

2 X* u* E! F1 S5 ^ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
7 G- h, h: d! V9 y) J. {
4 P# d$ ^5 E5 b4 Z8 u+ u9 vERROR:Map:115 - The design is too large to fit the device.  Please check the
  ?( C4 X: A1 n/ r   Design Summary section to see which resource requirement for your design
   exceeds the resources available in the device.  In particular check the
   non-slice resources since the slice counts may reflect the early termination
   of the flow.

9 t2 S7 n+ H0 V9 t; O   NOTE:  An NCD file will still be generated to allow you to examine the mapped
   design.  This file is intended for evaluation use only, and will not process
' p5 r! a6 L& j1 D   successfully through PAR.

: n. w  X9 k" _3 ~ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
換較大的 package or 減少 IO 使用數量!