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8 Failure Modes, Reliability Issues, and Case Studies 228
, n( y* P7 E' r! ]" d7 C! V% \6 N8.1 Introduction 228- m' c2 f: C! g+ Y- S: k0 T
8.2 Failure Mode Analysis 229: ]2 ~" L; Q( m# h9 H
8.3 Reliability and Performance Considerations 238& j {; F6 n$ C8 Y7 n* D4 v
8.4 Advanced CMOS Input Protection 239( t5 ^, T% ~/ o* i
8.5 Optimizing the Input Protection Scheme 242* S: L8 J; K8 Y& w% `& x7 ^
8.6 Designs for Special Applications 249
A) ~. M: J2 @" r) C8.7 Process Effects on Input Protection Design 2535 X3 s7 s" M. Y D w s
8.8 Total IC Chip Protection 255% L5 R" Q/ B B
8.9 Power Bus Protection 256( y$ z6 r$ [/ R; `! ]- K8 q
8.10 Internal Chip ESD Damage 2586 i, X/ L/ [0 _( \* {" b# Q
8.11 Stress Dependent ESD Behavior 263
y0 A6 |# K6 O. B2 f: W) c8.12 Failure Mode Case Studies 267& s2 A3 n( m' O( {$ J+ V- X
8.13 Summary 271
) Y) z+ ~8 k) o& `& j: g3 aBibliography 272
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