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Layout Guidelines for Optimized ESD Protection Diodes
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7 N8 ?+ R2 W) X/ m! _Karan Bhatia and Elyse Rosenbaum' h! ?' ]9 S2 c
Department of Electrical and Computer Engineering • University of Illinois at Urbana-Champaign% b4 Q2 J0 y0 @. J
1308 W. Main St., Urbana, IL 61801 • Tel. +1-217-244-0578 • Fax +1-217-244-1946 • Email: ksbhatia@uiuc.edu
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Abstract - In this work, various layout options for ESD diodes’ PN junction geometry and metal routing are( C P1 I( h+ X$ a7 ?
investigated. The current compression point (ICP) is introduced to define the maximum current handling
2 n# c; Z$ e ocapability of ESD protection devices. The figures-of-merit ICP/C and RON*C are used to compare the* v. i0 M9 d3 Y3 [6 t# ?
performance of the structures investigated herein. |
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