|
Layout Guidelines for Optimized ESD Protection Diodes4 q- ]8 h; h2 C
) Y8 h5 @# B. p, ^! e; p
Karan Bhatia and Elyse Rosenbaum
2 t" n3 C$ P6 N6 F/ eDepartment of Electrical and Computer Engineering • University of Illinois at Urbana-Champaign6 W) s/ }& O5 F9 L
1308 W. Main St., Urbana, IL 61801 • Tel. +1-217-244-0578 • Fax +1-217-244-1946 • Email: ksbhatia@uiuc.edu
( a2 [' X7 Q3 ` k7 F2 F5 J
) J. q. l2 }6 n% r% D1 R k) yAbstract - In this work, various layout options for ESD diodes’ PN junction geometry and metal routing are
5 j) M/ b8 z2 C2 m) kinvestigated. The current compression point (ICP) is introduced to define the maximum current handling, z( H, F% S- h) n a" I. X
capability of ESD protection devices. The figures-of-merit ICP/C and RON*C are used to compare the
8 Z# P; y6 d7 r1 |9 tperformance of the structures investigated herein. |
本帖子中包含更多資源
您需要 登錄 才可以下載或查看,沒有帳號?申請會員
x
|