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Layout Guidelines for Optimized ESD Protection Diodes3 z1 N* ^& r% ^( @2 {/ ]5 a
& K" I8 `9 G0 g! UKaran Bhatia and Elyse Rosenbaum% e4 W1 C1 c' W
Department of Electrical and Computer Engineering • University of Illinois at Urbana-Champaign
1 v1 C. m) I# F1308 W. Main St., Urbana, IL 61801 • Tel. +1-217-244-0578 • Fax +1-217-244-1946 • Email: ksbhatia@uiuc.edu$ @# k) H' \; d, ?) D
9 e& N5 {. o: @7 d# O+ c2 L% M4 qAbstract - In this work, various layout options for ESD diodes’ PN junction geometry and metal routing are9 v3 }& ]) g% K! _) V
investigated. The current compression point (ICP) is introduced to define the maximum current handling
. }3 y1 D9 c! C+ a# F5 R* _* O, s' xcapability of ESD protection devices. The figures-of-merit ICP/C and RON*C are used to compare the
: u; \; s2 L7 E/ R1 ~* X2 M9 T- kperformance of the structures investigated herein. |
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