ISE的問題...請教前輩們

mclaren_18

   如題:
各位大大們:
. J0 L" m! n; g* G4 X3 U" k. K請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
我的IOB超出範圍出現以下錯誤..該如何解決啊??

ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
" I  g" c) b; ]: `
5 ]% }' w8 w. N0 s" LERROR:Map:115 - The design is too large to fit the device.  Please check the
4 @9 K+ U3 |# E) J9 u( v   Design Summary section to see which resource requirement for your design
! _7 S8 B. u; |9 Y; i5 Q& F   exceeds the resources available in the device.  In particular check the
+ v! f# }( }2 X7 [2 z0 ?3 Z   non-slice resources since the slice counts may reflect the early termination
   of the flow.

   NOTE:  An NCD file will still be generated to allow you to examine the mapped
   design.  This file is intended for evaluation use only, and will not process
0 T4 b! A) s* S" `9 `3 j   successfully through PAR.

ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

6 p: u7 F2 P  k+ }0 o& B謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
* b6 [) X9 I. Y' U+ |$ m9 {$ V換較大的 package or 減少 IO 使用數量!