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Title Responsibilities:2 P; ]7 V9 a* K2 P% f
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1. Coordination among module engineering, SPICE, desgin service, reliability, fab, on technology development. ' O- e5 ~9 [ g! d
2. Responsible for leading and mentoring an engineering team in process characterization, problem solving, yield improvement, and documenation. O. S# z( f, R4 A0 v6 J8 ^8 t
3. Planning, setting priority, and exeution of short and long term tasks. . N4 f+ l/ u: M0 E& N
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Requirements:
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, N9 [/ _! E& a. C1. Minimum master degree in engineering field
- X: \$ c0 K- |% U0 G: P2. Minimum 5 years of experiences in process integration or device engineering.2 L: i& L# z3 d* Q% e% \) }
3. Candidate with design or product experience is a plus) {+ k S- Q P
4. Fluent in English.7 ]- J4 @$ y5 C/ }# {* w1 n ]0 S
5. Work location in Hsinchu, Taiwan."& ? z9 m+ [9 `6 ^4 F/ ^6 H
# O/ U2 k2 w" u: |0 x: IPackage: around annual NT 300萬 ~700萬
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; e" |3 h# s# Y( h! x) fStock: providing stock option depends on experience" b& j, @6 Y8 [- f5 t+ \
" ?* @5 q, U1 L3 a8 _ z* K意者請與 chip123@chip123.com.tw 聯絡! |
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