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Title Responsibilities：7 S& @: m' k. C) V! R
3 c% N: h1 M: B, J+ u( r1. Coordination among module engineering, SPICE, desgin service, reliability, marketing, , and fab on the delivery of tsmc technology.6 f: R0 u( P: _& A+ o' S
2. Responsible for technology development, characterization, qualifaication, transfer, and early customer engagement.: I x% t/ H; Y* q
3. Planning, setting priority, and execution of short and long term tasks. / c- A7 u3 u8 I
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Requirements：
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1. Minimum master degree in engineering field
( o, n7 M! V J3 u$ j f+ U2. Minimum 8 years of experiences in process integration or device engineering.
* K: A2 A* |5 L# H3. Candidate with design or product experience is a plus
; e4 ^7 @3 C$ R( S5 h) i. o4. Fluent in English.1 o" H% b8 g0 U ^, H
5. Work location in Hsinchu, Taiwan."" d! N8 n" c; q7 o+ M4 _/ q K
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Package： around annual NT 300萬 ~700萬1 e4 r9 c1 V8 X4 K: s3 a0 l' Y
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Stock：providing stock option depends on experience
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意者請與 chip123@chip123.com.tw 聯絡！ |
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發表於 2006-11-20 13:19:02
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