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[經驗交流] ASIC設計工程師如何保住飯碗?

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41#
發表於 2014-6-12 10:46:55 | 只看該作者
Junior Physical Design Engineer+ D4 m# u9 h4 \# z" [( i

5 {6 H5 j) e! D0 B4 i+ p; V& T公      司: famous IC company5 P1 s' `  K+ j* J8 g. ^
工作地点:北京
! Z, J3 Q% |6 q/ R8 h/ x' A; ^3 Y' {5 j' J1 N- k3 a$ b5 A
Position Tasks, Duties and Responsibilities
  U% v2 w2 `$ N7 PThe ASIC Physical Design Engineer will: $ Q" E) i" U9 M3 Y; u8 I6 T
        Complete third party IP integration and ensure vendor guidelines are followed.
* V, P) o) D9 i        Responsible for physical verification (DRC/LVS).
9 s2 {8 h& e* k        IO ring design, fullchip floorplan.
* H+ P" _/ S9 o! E( C8 ^: G7 r        Block level implementation.
6 ?) r3 d3 y4 N, b        Work with front-end engineers to resolve problems and achieve design closure.   p+ m. W, J6 }0 H9 j: a4 X5 l

! D1 e: [! ~* `+ z1 N' SCandidate Qualifications:
; [: M9 m2 i2 tCandidate must:
7 _. ]6 V3 @- g        Hold BSEE (MS preferred). ! X& J, u  P2 t( d- N9 z( I! \" ~' N
        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification
2 {( b; S5 d& F- L) H- S        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC. 2 ~* o9 l2 f$ c0 y
        Have the ability to independently identify and resolve design, tool, and flow problems. * o; o4 v7 ^+ I& `6 N0 E4 v" x
        Have related timing and physical concept.
5 _& B: Z$ q9 Y% n        Be able to design and implement physical design strategies and methodologies for deep submicron designs.$ v4 r) x+ t: l, S+ w4 V
        Familiar with EDA tools.
; `' d3 {( j+ F  Y( J1 h8 y        Familiar with Linux environments.  
, D1 L; `0 ]9 D6 V6 }' ?5 K' l( J5 Z, c/ e& o) H3 N
Any of the following is beneficial:
3 e4 e2 A+ e, }' V  X- d        STA constraint design
: `5 ^& o9 s% l; r       Equivalence checking ?RTL to gates, and gates to gates.
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42#
發表於 2014-6-19 09:41:01 | 只看該作者
Junior Physical Design Engineer0 R6 l7 D; l/ _, f

  ~6 ^* d$ K& p) `& X3 K3 F公      司:A famous IC company
7 Z: |( P! ^& ~, y- N) W$ m& X7 T0 W工作地点:北京
$ i9 L$ n' N2 Y; r& T8 M2 e7 B9 U: W7 z: |) c, v" h
Position Tasks, Duties and Responsibilities " s+ i& z. d& b6 J- I
The ASIC Physical Design Engineer will: 7 Z5 p" K5 j* z0 f: G
        Complete third party IP integration and ensure vendor guidelines are followed. % T0 q! H/ M" P6 c
        Responsible for physical verification (DRC/LVS). ' C: ]  O0 d4 N; f. G) `
        IO ring design, fullchip floorplan. $ d4 y: b& N( K( F, x, g
        Block level implementation.   ]% M, y1 a# N4 x; Q' m. o% F
        Work with front-end engineers to resolve problems and achieve design closure. ; L* Q5 o; _/ d! K
8 h) Q2 A% L" u$ b
Candidate Qualifications:
3 \/ q. l/ K5 _, f$ X0 N( N" c& cCandidate must: : \! }( Y* U1 t! e2 o
        Hold BSEE (MS preferred).
* \$ X" ^/ r% m2 s4 w% Y; L        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification
- m, i8 t! `0 `5 F        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC. 6 z" l5 Z1 b" M0 R* L9 V: w/ }7 I
        Have the ability to independently identify and resolve design, tool, and flow problems. , U. L" [. E/ ~+ |) M
        Have related timing and physical concept. % u! V- A3 \  n3 a
        Be able to design and implement physical design strategies and methodologies for deep submicron designs.& H* z1 ^- v: X6 ]% X- |* U- `
        Familiar with EDA tools.
& T1 J# o) `% ^9 T1 `        Familiar with Linux environments.  % `' s, b4 r% d5 V
& U: H" ~/ F- V/ y4 s0 s
Any of the following is beneficial:
1 ]; j  }6 j; N3 S* E6 I0 T& W        STA constraint design % `  z: K) F# j6 z1 R8 ^. ^8 b2 }
       Equivalence checking ?RTL to gates, and gates to gates.
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43#
發表於 2014-6-19 09:42:41 | 只看該作者
Sr. ASIC Design Engineer (encoder/decoder)
. @; [5 m! R4 ?) J: T6 p7 z2 W
+ }& I( O, q3 T6 F7 b: c: w公      司:a leading developer of advanced digital imaging solution" ~, u0 ?5 Z2 V! x# U# V
工作地点:上海
) {( G; E) _" }. s/ I% F
3 ?6 t* X0 c5 j: F) y  yPosition Overview: The candidate will join a team of  highly competent ASIC designers involved in design, verification, and implementation (ASIC) of advanced platform for XX''s future generation multi-media products.   % r, D* ]3 ]& X: E+ ^6 m( V6 L
1 s3 Z3 F3 z) f' w3 z# @7 v- y
主要职责 (70%)
3 j' E; s% ?1 J& r/ ~0 pIn-depth knowledge of TV encoder and decoder design. Good understanding of TV system design.  + j4 a: K2 m  W! _; \0 |
Proficiency on digital filter algorithms and hardware implementation. ' D6 ?4 f! g! U: S
Development and verification of complex IP module, integration of the IP module into the Soc devices, top-level design handling, system level testing. ( l  K( y/ a+ p4 G
Participate in the FPGA platform development and lab debugging   7 U& t$ f/ H) y5 @- X- Q2 n4 o

+ S" M. C' O$ ?& s* N" K8 c. M其他职责 (30%) . ^# r) C& W; N& h# C$ [6 a
Participate in block level architecture design Assisting embedded FW development.; n. M' P% {" ]* Y. }3 I
职位要求
& u" X8 Y& K- {. T1 K+ {岗位资格
! K" Q& _4 j% U: v. G1 j# S9 q9 w+ T经验/技能 ! S/ e/ V  B9 y/ s$ l7 ]& b
1. Strong knowledge of TV technologies, knowledge of image signal process and CCTV system is a plus * r9 h* I; P1 V7 h0 C
2. Strong knowledge of ASIC design flow. Can define Micro-architecture of the IP module and /or sub-blocks. And able to write detailed engineering specifications. $ p$ D2 z8 t9 @3 o5 G# R/ |
3. Good communication skills, especially in technical writing and reporting;
' V8 U/ j- Y- o4 E4. Self-motivated and ability to excel in a team environment.    # d) D2 H: W' y5 I. e
7 ~, n6 k( _' A) E* L, f7 [4 b
教育 6 [: W" X* P6 F) Q
MSEE/CE with 3+ years of industry experience
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44#
發表於 2014-6-20 09:03:13 | 只看該作者
Senior Digital Design Engineer( P( B+ p# T* t7 i+ r4 z! L

: x! W+ V; H- N; R" v$ L4 w. S9 z公      司:A leading semiconductor company8 C  U' s7 ?1 S8 `
工作地点:香港
0 T7 A: l9 N; M2 d- o
3 `' a4 z! Z$ i9 H) J: m6 f0 NJob Responsibilities: . H! I+ Z& G$ X& O' e
    Perform logic design, RTL coding, design verification, logic synthesis, DFT and static timing analysis
) F" J) e; O& W    Develop verification environment and coverage closure : q& x  ^8 g; h2 ~# L: ^  p* X1 u
    Support wafer level testing and silicon evaluation
$ U$ \* S7 `; h! U    Prepare technical documents
: c4 O) \' t; |- L, Y: ?7 ?" U
' V. B, u8 V6 C. ^2 S* I! \Job Requirements: - i; y- H* {/ B# T# v2 j) y
    B.Sc or above in Electronic Engineering or equivalent. Applicants with postgraduate degree would be considered as an advantage* J6 \) x$ k2 |
    5 Years or above of solid experience in one or more of the following areas: Verilog-based logic design and synthesis, constrained random    testbench with System Verilog & UVM, assertion based design verification or circuit-level SPICE simulations , i  N! q4 y$ Y1 {. y3 ?$ g! Q+ s
    Knowledge of SoC and embedded system.
; r+ Y6 c) V' J* ]& p    Knowledge of scripting languages such as Perl, TCL and Make
, k# \; t& {$ L' @8 @& ^% Y, ]    Candidate with less experience will be considered as Digital Design Engineer
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45#
發表於 2014-6-24 11:57:06 | 只看該作者
Junior Physical Design Engineer9 Y& f7 ~' R; o' _, f6 \* Z
公      司:A famous IC company
1 C& k* i4 P1 u4 r1 @工作地点:北京
- R4 S6 u" L$ `8 i2 a* d6 D! l" F1 r/ K, k
Position Tasks, Duties and Responsibilities
3 N  X3 o- m% W# j4 L3 \0 XThe ASIC Physical Design Engineer will: ( _# S; W$ r2 F$ O6 E) {5 r( ]6 k
        Complete third party IP integration and ensure vendor guidelines are followed.
! _0 S% l8 `* [, C5 {7 i2 {8 u        Responsible for physical verification (DRC/LVS).
  `; M/ {. S( R' e        IO ring design, fullchip floorplan. + W' S( f. _# E$ O% d# z
        Block level implementation. 9 ~6 d: V4 J" {2 J, X4 N
        Work with front-end engineers to resolve problems and achieve design closure.
' a6 [8 z: w: x$ j) X/ X# [4 k
( X0 e( |+ H# q  L6 f/ n5 L0 hCandidate Qualifications:
( s7 S4 T& n# b  bCandidate must: " F! W8 o: b  C' S: X" S
        Hold BSEE (MS preferred). 7 B+ j& L3 x" d" I5 ?- X
        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification
! q7 s& A" f0 J( o        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC. # d9 ?+ G) g/ [  U1 Y4 ^+ D# c3 T
        Have the ability to independently identify and resolve design, tool, and flow problems. 9 W& a8 i$ _: I2 [& W& H& b
        Have related timing and physical concept.
( W; G$ q3 Q: O        Be able to design and implement physical design strategies and methodologies for deep submicron designs.
* w3 O3 }0 \0 g  g: I        Familiar with EDA tools.
  j: a1 Y/ p" O0 w3 f        Familiar with Linux environments.  
& _2 Z" V: T9 o' I& e
# Q' K  c! a- L* X" q  `Any of the following is beneficial: % M! D% Z  X: p; V( z! e2 G
        STA constraint design 6 K/ S  E1 x9 P; P* H
       Equivalence checking ?RTL to gates, and gates to gates.
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46#
發表於 2014-7-31 12:31:20 | 只看該作者
数字芯片设计工程师(DFT/综合)
& l" t/ W. K8 \+ e5 P5 S0 v
/ v5 }- G5 y+ X4 Z5 Y8 H6 N2 T公      司:A mobile chipset semiconductor company
' ]- r' P: L7 i0 O+ [9 N6 l工作地点:上海
7 ]; O- c) K& F  @! F. [4 W' l0 f0 N6 S3 X% L# j3 W
职位描述:
) K/ ^6 g* y5 _/ p- d1、To provide and support SYN&DFT work for several projects in parallel  . `! b" l5 l' a1 k0 P
2、Run block level implementation for each project, include synthesis, DFT and LEC 1 Z. C4 z" ^$ T' ?* ^$ Z8 o' c# @
3、Support block level physical evaluation  : j' j+ ^# ?0 b. B2 o+ b, I$ h' S2 }
4、co-work with designer and provide block level SDC file & i, X5 O. I0 M  U7 `/ O$ t
5、co-work with Back-end team for timing signoff" g5 D. _' I/ t) N$ i

  B5 X8 S' x3 x( y0 r! w" ?职位需求: $ T& w6 C% O3 _/ a6 R3 T5 k
1. 了解集成电路设计的基本流程 6 C- Q0 G* s# `5 K- h% O" A, m2 s" r
2. 相关Synthesis, formal check 和DFT的工作经验。(3A, 3B, 3C精通一项即可) 2 g+ a: G2 [* h6 M6 G* s& K" [! k
3A. 有超过2~3个项目的synthesis 经验, 用过RTL compiler且熟悉timing的相关知识  
4 D% `7 X6 ^8 a3B. 有超过2~3个项目的formal check经验,熟悉CPF的low power flow
- p" M5 p1 `6 v) Y7 K% V; A  K  W3C. 有超过2~3个项目的DFT insertion经验, 用过Mentor DFT的优先考虑   m* Q# i( J3 V* I6 c* C, D
3. 具有良好的英语阅读和书写能力。
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47#
發表於 2014-10-29 08:13:11 | 只看該作者

ASIC Corporation將展示節能、高頻寬效率的C-RAN解決方案

西班牙巴賽隆納--(美國商業資訊)--eASIC Corporation:
# T3 r$ h; V, a
& D/ P2 H+ Z  V, r, b( {1 U: r人物:* D& p: K* E3 U/ p4 c

# {' C* I) h' i+ }0 \* B領先的單光罩自適應ASIC設備供應商eASIC Corporation將由eASIC無線業務主管Christian Lanzani博士擔任代表,負責整體無線策略,包括無線存取、去程傳輸(fronthaul)連線、基頻處理和回程傳輸解決方案。 # J; }; R3 o" M* x
2 T6 A5 `' G1 _7 U. Z
事件:4 T8 u% S7 c# v/ V% e8 G( H

. |3 J' C3 f8 r5 T7 H# YeASIC將作為聯合贊助商參加Wi-Fi世界高峰會、去程傳輸暨C-RAN高峰會(Wi-Fi World Summit & Fronthaul & C-RAN Summit),展示C-RAN去程傳輸在部署方面的挑戰,提供eASIC解決方案的細節。展示過程將包括無線存取、CPRI over OTN轉換器和基頻集區,包括L1硬體加速的使用案例。
8 g0 Z! H- l  C1 O5 l2 y3 j
) N: i0 p, C) s# }6 Z4 W時間:2014年10月29日,週三
. P  e4 |& }" m/ W7 J6 l5 e# C5 [地點:西班牙巴賽隆納赫斯珀裡亞塔樓酒店(Hesperia Tower Hotel) ; @, M& Y) p+ n

# A6 L; [5 S/ t7 z! `  F  R如需瞭解有關eASIC Corporation的更多資訊,請造訪www.easic.com。Wi-Fi世界高峰會、去程傳輸暨C-RAN高峰會細節可以從以下網址獲得:http://wifiworldsummit.com/- S& i# ]  b5 ]: O
2 F, V# p) Q0 e' G3 r
關於eASIC
3 K' k4 R4 c" Y0 ?& q3 O8 X' }$ F, }$ X6 }0 ~7 M
eASIC是一家無晶圓廠半導體公司,提供突破性的單光罩自適應ASIC設備,旨在顯著降低客製化半導體設備的整體成本和縮短投產時間。使用通孔層客製路由的專利技術實現了低成本、高性能和快速周轉ASIC及單晶片系統設計。這種創新構造使eASIC能夠提供前期成本顯著低於傳統ASIC的新一代ASIC。eASIC Corporation是一家私人公司,總部位於加州聖塔克拉拉。投資人包括Khosla Ventures、Kleiner Perkins Caufield and Byers (KPCB)、Crescendo Ventures、希捷(Seagate Technology, NASDAQ:STX)和Evergreen Partners。如需eASIC的更多資訊,請造訪www.easic.com
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48#
發表於 2015-2-23 20:44:05 | 只看該作者
Asic 的利基市場和 Fpga的利基市場 各有千秋.
, s3 C- y: r  }2 m* E  W
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49#
發表於 2015-7-23 21:32:34 | 只看該作者
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