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危機就是轉機?類比IC廠逆勢擴大徵求IC設計人才?你覺得去哪家最好?

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1#
發表於 2013-10-14 15:58:29 | 顯示全部樓層
Product Engineer -QA# ]- _! i1 t( y( }+ w% P
公      司:A famous IC company& l0 _, x! b6 H3 a. ~$ R$ g7 ^; m
工作地点:上海
2 N* c% E% H! d3 k1 F9 o' m
, T, W/ L2 G4 M( m" rPosition Summary: + J* S! y, I9 S; j  c! w
Essential Job Functions/Accountabilities: 6 x4 ]: [9 E% ^& S5 T
Work closely with RD and PE team to  ; I3 P' O0 c+ ?' Q( `: v. R: H
Make sure product (software) quality
: [; J: }2 O/ D9 w0 wQA system maintain and improvement 4 e: h& @) F. \% J
Daily build and daily regression test 8 ~& x" O8 d& D5 l/ \
Project management and risk control 0 k' r! J6 u1 g
Bug/enhancements verification and testing
, f) V% I. M5 C$ s" M* X) i8 ?: wProduct release and documentation
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# e8 ^% p7 U! u% BMinimum Requirements/Qualifications: : l# ?0 I4 R5 F& W8 Y
Strong scripting skill, Perl/TCL and LINUX shell required 8 w3 t% O0 i, U2 H
Experience of SPICE-based(HSPICE/Spectre/Eldo) circuit simulation " R7 H3 d- b$ X; M
Experience of package and PCB modeling and simulation with field solvers 2 }' h: J9 S$ c% L: j( N
Knowledge of High-Speed I/O (DDR) power and signal integrity analysis
" E, A  F3 o! L3 x* kKnowledge on die and IO ring physical design, LEF/DEF/GDS is a plus ) B" ?: F; Q; [- I: b  f
B.S. in Electrical Engineering or other related areas, 3 years of experience
5 p1 V- z+ k- P5 Q% F3 cM.S. or Ph.D. in Electrical Engineering or other related areas, 1 years of  experience, or equivalent combination of education and experience* H" o$ `. A5 K+ `) X2 Z9 q
Self motivation, teamwork and strong English communication skills ( both written and oral )
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2#
發表於 2013-10-14 15:59:08 | 顯示全部樓層
Sr. Software Engineer-电路仿真和建模" X% x' N$ z, v+ w  `

6 G; t8 \4 v  ^1 {5 X2 Q公      司:A famous IC company, g, x; F, T# ]  L
工作地点:上海2 @1 l  e- f1 i& ^; f7 E* Z- A) {
( N$ U" ?% p5 L5 |# d. l9 s
Position Summary:  * Z# `, h( K: @& }4 C+ |
Software development and product engineering for power and signal integrity analysis and modeling * x$ n) B  c# ]
Essential Job Functions/Accountabilities: " I+ A. r: ]& P/ ~$ Y
Maintain the IC-package power and signal integrity modeling software, conduct bug fixing and enhancements; develop new features to expand the application and improve the accuracy, capacity and speed; perform development level testings and work with application engineering team to resolve customer issues;, r7 [7 Y5 E! M2 V7 W. _
+ g% M+ Q# A# w9 C
Minimum Requirements/Qualifications:
) H6 G, O& ]0 f' BStrong experience in software development using C/C++ ! |/ r' J) g: T
Strong working knowledge in linear and non-linear electric circuit network analysis and modeling : d$ s  j* Z/ I
Knowledge ofSPICE simulation, or on-die and package extraction is a plus . m  z" M  {' J* S, W; [' C
Excellent communication (both written and verbal) skills in English 9 x% K! K2 Y2 C" S& v
MS, Ph.D. in Electrical Engineering, Computer Science, Physics/Math or related fields
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3#
發表於 2014-3-6 14:39:01 | 顯示全部樓層
Product Engineer
4 F' x4 T4 o" Z: p$ h公      司:A famous IC company
4 I- f6 k0 d/ @工作地点:上海9 v5 N+ H8 [2 x$ z( X/ U+ L: p' `

2 s3 q4 y& S7 e6 j1 `& p职位描述7 r+ r9 `% W5 n; M* S! ^
Ideal candidate will have completed BSEE , with 5 to 10 years experience in
1 \, ?! ]3 H5 cSemiconductor field. 0 t3 m( x4 z. k2 F9 z

. s; D7 {# j1 G, R9 v Candidate should have strong oral and written communication skills -must be english speaking. ) ~6 }7 N9 H, ?- `; G0 ]

: e. `0 u# W5 h, n' E' h" G6 ] Candidate must have demonstrated strength with analog circuits, and familiarity with typical lab equipment such as scopes, DVM’s, curve tracers, and function generators. Strong bench skills are mandatory.
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; o" [: I- J2 x' T* g+ Y1 m Ideal candidate will also have ability to debug IC’s to component level from design schematics and plots. % V, b, a0 C$ I- h% g. {6 w7 p/ t5 ]

6 X8 |# j) t2 p( B0 \- |+ S Failure analysis background is a plus. 8 s6 q3 t/ `  [5 b% ~: W0 U

+ W0 _( ^# f' [3 C8 [& I Candidate must also have ability to follow documented procedures, and must be able to work independently. Individual will report to management team in US.
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Job function to cover all aspects of New Product Development and Yield management,including bench-to-tester correlation, tri-temp characterization using ATE equipment, trouble shooting and yield management
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4#
發表於 2014-4-28 11:01:12 | 顯示全部樓層
高速模拟集成电路设计工程师
/ h" E$ V" j2 y公      司:A semiconductor company/ j/ r! A% z: W1 F* A2 K+ ]
工作地点:上海0 Y3 b6 `% u/ w; v

; `& F; N. y% `' ~6 [职位描述:  6 n* S# y3 ^# U# a( U
1、负责高速模拟电路的设计、开发、优化;  # c! h7 o" N( E; b
2、版图的设计及验证;  
$ k  V9 d5 u# {3、电路版图参数的提取及后仿真;  
" s" b& L0 s* E, s# Q4 H4、芯片的测试和分析。" _0 ]  ]; Y' P+ g8 v( e2 B& j

  |. c4 g. d0 q% c2 W- ]职位要求: 1 f9 y. Q: s: I6 Z! i! w/ L( O
1)微电子、集成电路相关专业硕士或博士学位,或学士学位3年以上模拟IC设计经验;  
! ~; w: t% r: K9 Z. s5 C8 B& }2)熟悉和掌握模拟集成电路及版图设计的原理与技巧;  
! J2 y8 R$ I9 |: X3)有通信系统用集成电路芯片设计和成功投片经验;  
; A0 z, ^$ k7 g3 R7 w6 @" p4)善于沟通、工作踏实、责任心强,具有良好的团队协作精神;  
3 A* V" u+ g: ]5)有下述项目经验者优先:高速锁相环(PLL),时钟数据恢复电路(CDR),调制驱动电路,宽带放大器,限幅放大器,跨阻放大器等;
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