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Per my experience ,Diodes + RC-Control , inverter and PowerClamp is better for out pad$ j( h2 t+ S K8 {
Generally speaking ,the root cause of ESD failed is from below.
1 u! P5 W# s- |: H8 G0 O<i>clamp NMOS's ability.8 F; O6 u7 Y6 k" }8 [) f
<ii>clamp NMOS's turn-on rate.2 R3 A$ }! z+ a
<iii>Not follow design rule.......................
4 ^+ O* k5 X5 g2 @9 DAs we know ,RC-control is to keep clamp NMOS off when IC is on normal operation.(us)6 j3 g/ C4 o' A: W& u1 i+ S
When sufferred ESD pulse(ns),GGNMOS be turned on by coupling .
8 I# K0 m1 G8 {' T; t6 `If adding inverter between RC and clamp NMOS,it will speed up clamp NMOS turned on.( c" g O" [1 m+ v$ [8 Q+ z9 y
Just for reference !!! |
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