Chip integrates baseband, multimedia processing and radio

jacky002

Chip integrates baseband, multimedia processing and radio
% l( q* x% T, s8 T& y% a
2 C9 Q* d! Y- u' _4 jBy Gina Roos
% A, C1 U3 T3 D' ^6 m
$ g! n. ?; |9 C% n! S6 }

Courtesy of eeProductCenter
4 y6 D  \; {: Z7 F( P- S: Z(02/15/2008 10:23 H EST)

1 K, u3 u, U3 V* ~7 W6 |. e    San Diego, Calif. — Qualcomm Inc. has introduced a new single-chip solution that brings multimedia and broadband capabilities to mass-market handsets. The Qualcomm Single Chip (QSC) QSC6295 integrates baseband, multimedia processing and radio functionality into a single chip, touting cost- and time-to-market advantages to help drive wireless broadband and 3G adoption in mass markets.
  _+ F3 y6 Z/ b/ i# C/ W
    The QSC6295, which leverages advanced 45-nanometer CMOS process technology, combines multimedia features, power-saving innovations and broadband data speeds to redefine the capabilities of next-generation mainstream handsets, said the company. The single-chip solution offers a combination of advanced modem capabilities, including HSPA and HSPA+, and rich multimedia features to deliver a next-generation mobile user experience on mass-market handsets.
' `* s6 c( m2 `$ \- x
7 l' E" S1 f, v: n    Key features include:

6 g' ^  I% j8 O! w        * 400 MHz ARM 11
. i  h$ d& e. ?; F7 U# V0 `; C; D        * Support for WQVGA video playback and recording with TV-out
3 @9 U# v6 m" @4 t! q, A/ z        * 5.0 megapixel camera
: n! s( W$ O: U( B9 e* F        * 3D hardware-accelerated graphics
7 y+ N$ C# s, y. A) U        * Integrated gpsOne baseband and radio
        * Integrated Bluetooth baseband and radio, FM radio and USB 2.0 HS
) L2 U$ P5 n! i* m# T        * Support for all UMTS bands and quad-band EGPRS, as well as receive diversity for enhanced data throughput performance
        * 12 x 12-mm package
6 i2 L4 a. p- {1 ~- @: l( i
    The QSC6295 also integrates several features of the UMTS Rel. 7 standard (HSPA+) to deliver increased battery life, as well as a more instant experience with reduced lag.

+ ?# E5 Q/ y- k( H% [    Availability: The QSC6295 is scheduled to sample in the first quarter of 2009.
- F+ C$ o; O5 n; W" P
' ?+ P- z7 H2 b: b* _& |    Qualcomm Inc., www.qualcomm.com
2 r6 E4 [5 g' n$ Z6 H
2 {, G6 f1 w# W9 ~. C, G; j+ `' nSource: http://www.rfdesignline.com/showArticle.jhtml?articleID=206504545

jacky002

請問各位先進，如果要將MAC + BaseBand + RF整合在一起，其難度有多高?
最近在想一個問題，就是未來的Wireless BroadBand市場，會不會是以NPU + MAC/BaseBand + RF + Switch/PHYs整合在一起的解決方案? 那這樣豈不是一統天下?
2 r; ?9 r7 E# p9 h5 ~9 m+ T到底這樣的SOC其優勢和劣勢會是如何呢?
7 L4 n4 w/ p; p6 `; ?4 b" Z我先提出看法:
7 t# t# W1 R) i4 g6 T7 r  優勢(Pros): Cost down與高整合度的解決方案
* C  w0 X3 S6 _9 d  劣勢(Cons): Power consumption極高，整合技術難度高與Yield Rate低

不曉得各位有何看法呢?