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Which verification elements does your team use on your current design project?

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1#
發表於 2013-9-3 15:37:35 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
Pls check all that apply, unless you don’t know?
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2#
發表於 2013-10-22 15:35:35 | 只看該作者
Staff Hardware Based Design and Verification Engineering Lead: q& V- c7 y" [: V3 i9 S
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公      司:One world top EDA company
: c6 r8 R% p5 R) T8 I1 l: r工作地点:上海
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- I2 `' ^  w! S& E! M7 t* }' h( xPosition Description:  
0 _  X; M. \1 p3 D0 x1. The Staff Hardware Verification Engineering Lead will be in charge of a team of field engineers to support advanced hardware based verification flow integration engagements with Cadence customers and provide easy-to-adopt packages and workshops to xx  field application engineers and customers alike. 5 L  O! X: c6 _/ H( x' E, ^

7 V: C$ d: Z' Z2. He/she will focus on the technical aspects of the following hardware verification solutions for customer engagements as well as creating demos/workshops to train field AE and customers:
7 t2 H( l' l! b1 `  ]) g(1) xx  Palladium HW Acceleration Platforms , w% G6 V) e5 N4 N; E: @
(2) xx Acceleratable Verification IP portfolio
# k( @( r7 x; @- ~(3) CVA product integration with other xx products such as Incisive Simulation and RTL Compiler for power analysis: g4 }# Y! p1 D
(4) HW/SW Co-verification solutions for SoC designs
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3#
發表於 2013-10-22 15:35:41 | 只看該作者
Position Requirements:  - {2 ?/ M7 w+ M
1. Experience:  
# P) g: I' y1 P, f8 I1 S- Minimum experience required: 10 years  . C$ d) l! b& c* R( {3 I; {, M) l  ?
- Expertise in RTL top-down design and verification methodology automation are required. This includes full hands on knowledge of writing and debugging Verilog, VHDL and SystemVerilog based D&V environments.
0 `  X/ p' @3 `, q0 ^- We would also like the candidate to have good knowledge of SoC design principles, embedded software development and HW/SW codesign and coverification., j" A7 f2 g2 ^  @: ]" Z
- Knowledge of UNIX, C/C++, other scripting programming languages ( Perl, TCL…) is highly desired
2 U3 A* H& j$ @2 B7 w- Strong verbal and written communication skills in English are required  
8 |3 d/ k$ ^' V! p0 U- HW acceleration or In-Circuit Emulation or FPGA prototyping experience is a must 7 t7 O* y. v2 N! K
- Hardware verification, including knowledge of HDL simulators and debugging simulations / F) W8 E5 S4 i/ d9 v, l5 ~
- Hands on experience with using design and verification languages like SystemC, SystemVerilog (IEEE 1800) and VHDL is a must.
& H" B8 ?" [$ v: M4 n5 v' O- Knowledge of embedded systems and software development for SoCs is a plus ) C2 }3 h) p- ?# z
2. Education:  5 `9 m6 m; C; }& @" }1 l
Ideally the person should possess the BS/BE level of understanding of CS or EE Engineering concepts  
# g) @! b8 c  q" I6 H3 U- Minimum Education Required: education level of BS with 10+ years experience (or MS with 7+ or more years experience). 2 Q" S/ Q* S* N) H6 W9 A: f
3. Travel of 30% of the time should be expected.
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4#
 樓主| 發表於 2013-12-12 09:14:21 | 只看該作者
Senior Physical Design Engineer) I# f" r$ i9 q( E9 Z
公      司:A famous IC company! {: q! e/ l& o& W' g) j7 v3 S
工作地点:南京
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6 r) K. s6 n$ T' Z, jKey Responsibilities  ; R2 H+ [0 K0 M) S/ i5 `
Depending on experience, key responsibilities will involve some of the following:  . E) n* y* i+ y; l8 Y3 a
IC implementation from netlist to gdsii, with synthesis, floorplanning, place and route, timing closure, and physical verification.
) k# M7 B; o' E8 [! f( D" f0 p. ~As a key member of physical design team, your will work on one of most advanced and the most complex chip designed.
6 |% o+ G8 L9 N) U' DLeading a team of physical design engineers and resolving the technical related issues.  
* g9 Z3 Q) p6 e0 V  `Crosstalk analysis, power analysis, and static timing analysis.  8 c+ `- s! r  ^
Write scripts in Tcl to improve productivity.  
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职位要求
3 ^+ Q( N$ X- T$ b$ G: z- P' M* jExperience: 5+ years in physical implementation engineering   
# m5 m3 d, K. w5 uEssential skills  + l1 k* I( E1 O6 o5 Z  B
MS in EE required.&#8226roven track records of working independently on place-and-route project running and DRC/LVS/ERC/Antenna debugging skills  
9 Z6 ]4 o1 R. Z4 j* aExperience with Magma or Synopsys place-and-route tool set and physical design project implementation.  
& y5 N! f9 `& ]& U  t, aGood programming skill. Capable of writing Tcl or Perl.  
$ z1 ?) D9 [. M# k  sFamiliar with synthesis, static timing analysis.  ( t: F: V! p# Q, b) ^( Z/ H3 a1 F
Self-motivated team worker, good verbal and written communication skills in English.  
: L* y1 _/ b5 x% h9 UTechnical and team leadership proffered. Previous management experience highly desired.  
/ @* ]) k; ~5 LExperience with synthesis, DFT, and verification is preferred.
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5#
發表於 2014-9-29 13:57:16 | 只看該作者
Mentor Graphics 與 TSMC 合作為10奈米推出 IC 設計和結束基礎架構
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% f& M0 ^- n  c. x5 G  ^4 @ 俄勒岡州威爾遜維爾2014年9月27日電 /美通社/ -- Mentor Graphics Corp.(納斯達克:MENT)今天宣佈該公司與 TSMC(臺灣積體電路製造股份有限公司,簡稱台積電)達成10奈米(nm) 的合作協定。為滿足用於早期客戶的測試晶片和IP(互聯網協議)設計起動的10奈米鰭式場效電晶體 (Fin Field-Effect Transistor;FinFET) 的工藝要求,已經改進了物理設計、分析、驗證和優化工具。基礎架構包括 Olympus-SoC™ 數位設計系統, Analog FastSPICE (AFS™) 平臺(含AFS Mega)和 Calibre® 結束解決方案 ( Calibre® signoff solution )。 ' T- ?$ J/ }/ F2 ]2 x1 [" }

( B7 a+ @* p1 K: l" \0 G' zTSMC 設計基礎架構行銷部 (Design Infrastructure Marketing Division) 高級總監 Suk Lee 表示:「TSMC 和 Mentor正在進行廣泛的工程工作,以便讓雙方的客戶都能很好地利用先進的工藝技術。每一個節點都需要進行許多創新才能滿足新的物理要求、提高客戶設計賦能 (design enablement) 的精確度,與此同時性能更優、轉回時間更短。」 9 q; m+ V. c# \* ?
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Calibre 提供佈線形狀的全色彩能力,以幫助設計者指定符合10奈米規則要求的設計艙(cockpit)之外的色彩分配。針對制定積體電路佈線圖,改進後的Calibre RealTime 產品能進行互動的色彩檢查,同時利用晶片廠認可的Calibre結束平臺能使用所有制定佈線工具進行設計。
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6#
發表於 2014-9-29 13:57:22 | 只看該作者
針對10奈米  FinFET 設計,Mentor 和 TSMC 還改進了Calibre 填充解決方案。Calibre YieldEnhancer 中 SmartFill ECO 的功能支援「隨時填充 (fill-as-you-go)」工作流,以確保IP和其它設計模組在設計過程中都能準確地呈現。當部分設計被修改時,SmartFill ECO功能可重新填充僅僅受影響的那部分,從而最小化轉回時間 (turnaround time)。同樣的,為在諸如TSMC10奈米這樣的先進工藝節點上維持設計層級實現高效的佈線後模擬, Calibre LVS 也被改進了。
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兩家公司還聯手調整了 Mentor® Olympus-SoC 的佈線和路由系統讓它能滿足 TSMC 的10奈米 FinFET 的要求。為了能用於10奈米 FinFET,數據庫、佈線、時鐘樹合成、提取、優化和路由引擎都做了重大的改進。 . v+ ^8 ^; @6 j! I6 l) K) {% D' C
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為了確保10奈米 FinFET 設備的準確的電路類比,Mentor 與 TSMC 合作讓 BSIM-CMG(伯克利共多柵極電晶體)和 TMI 模型在 Analog FastSPICE 平臺(如AFS Mega)上能用於高速設備和電路層模擬。Calibre xACT™ 提取產品和 Calibre nmLVS™ 產品也支援新的10奈米 FinFET 模型。
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' H( _1 a+ j# H' U$ }- U3 P因Mentor 和 TSMC在設計賦能方面的合作讓客戶取得成功的案例,將於9月30日在San Jose Convention Center(聖若澤會展中心)舉行的TSMC的開放創新平臺生態系統論壇(Open Innovation Platform Ecosystem Forum)會議上講述。瞭解詳情,請參訪TSMC網站 www.tsmc.com
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