目前你最常用來測量影響IC封裝散熱效能的因素是？

innoing123

分析散熱完整性的第一步是深入瞭解IC封裝散熱指標的基本面？

目前最常用來測量IC封裝散熱效能的方式是Theta JA值，這是從接點到環境所測得(或說形成)的熱阻。Theta JA值最常被拿來解析、測量和計算Theta JA，其中影響最大的因素？

innoing123

采鈺研發晶圓級氮化鋁LED 封裝技術達頂級水準

【新竹訊】在經濟部技術處科專計畫支持下，采鈺科技與中科院第四研究所共同合作開發晶圓級氮化鋁LED技術，其20W 超高功率VISES系列 LED氮化鋁封裝燈珠產品，11月成功通過美國Energy Star能源之流明維持率（LM-80）的品質驗證要求。

政府發展綠能科技政策，技術處規劃能源領域產業技術發展，中科院科專計畫投入開發高導熱晶圓級氮化鋁技術，采鈺科技看好氮化鋁基板應用前景，與中科院攜手合作開發晶圓級氮化鋁LED技術，整合采鈺的晶圓級封裝製程技術及中科院的晶圓級氮化鋁封裝基板技術，並將導入產品開發及量產。

采鈺科技表示，氮化鋁具備高熱傳導性、高絕緣、高崩潰電壓與高電子移動速率等特性，是最佳的電子元件絕緣散熱基板。

ranica

package engineer
公      司：A famous IC company
工作地点：上海

Responsible for providing total package solution on BGA, QFN, QFP & FCBGA packages
  Responsible forsubstrate design release and electrical / thermal simulation result recognition
  Manage production issues in subcontractors
  Working together with product/test/quality engineers to improve production yield
  Maintain and develop resource to support new prototype samples  
  Price negotiation with suppliers
  Other jobs assigned by department supervisor

  M.S. or B.S. degree in engineering
  Over 5 years’ hands on experience at package house or fabless (subcontractor operation)
  Strong background on package development on BGA/QFP/QFN packages
  Experience in package process and yield improvement activities
  Ability on package feasibility study on substrate layout and bond ability check
  Familiar with SIP products
  Good mentoring, communication, presentation skills and team work
  Strong data analysis and technical problem solving skills

Preferred qualification:
  Experience on substrate layout
  Experience on package level electrical simulation  
  Ever work background on wire bonding, especially on copper / alloy wires
  Project management or NPI experience