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Abstract -- The diode operated in forward-biased condition has5 G2 T' X- C6 u a( g
been widely used as an effective on-chip ESD protection device at6 Z! }0 a' N8 A
GHz RF and high-speed I/O pads due to the small parasitic
: o) X; [6 c- s3 _& }loading effect and high ESD robustness in CMOS integrated
, S! L2 y; e% [7 X2 c5 R! T8 z( gcircuits (ICs). This work presents new ESD protection diodes
) w* a' T2 s Crealized in the octagon, waffle-hollow, and octagon-hollow layout. Y0 P6 K2 W. l' ^% l3 n6 s9 E
styles to improve the efficiency of ESD current distribution and
% ~) R. {$ b) d6 Nto reduce the parasitic capacitance. The new ESD protection9 [; N Z5 i4 P2 S2 s4 t
diodes can achieve smaller parasitic capacitance under the same e1 F0 r% v1 X4 w+ `2 G
ESD robustness level as compared to the waffle diode. Therefore,0 J; F: h9 z# c) w3 a t$ C
the signal degradation of GHz RF and high-speed transmission9 d0 U7 L( I% I L
can be reduced due to smaller parasitic capacitance from the new$ ~8 E) o3 l% b0 k. z
proposed diodes. |
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