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發表於 2010-6-25 08:50:33
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Abstract -- The diode operated in forward-biased condition has, \$ L1 l* G! h; d$ A
been widely used as an effective on-chip ESD protection device at
$ a$ V) b' v! R/ t- k* Y/ kGHz RF and high-speed I/O pads due to the small parasitic: C6 G$ W4 I8 @. y0 b
loading effect and high ESD robustness in CMOS integrated
4 X$ P; H; Z) b- r" G2 M5 S, A% acircuits (ICs). This work presents new ESD protection diodes/ n& \, y6 V/ v7 \. l
realized in the octagon, waffle-hollow, and octagon-hollow layout. ~ E4 T6 P3 V, `& i0 h0 ?
styles to improve the efficiency of ESD current distribution and
7 E9 X3 [; ]* U3 G$ B$ R$ Pto reduce the parasitic capacitance. The new ESD protection
" {) T/ g k0 L. J: |( Pdiodes can achieve smaller parasitic capacitance under the same
- g- D7 B7 h0 x7 L ?5 o7 K7 |ESD robustness level as compared to the waffle diode. Therefore,
/ y# n5 S" G; A3 Wthe signal degradation of GHz RF and high-speed transmission- r5 H/ t- l! F8 f
can be reduced due to smaller parasitic capacitance from the new
5 K0 s6 s" ^8 `- tproposed diodes. |
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