Which design service company you will go to?# n2 u1 s* m4 [( [' V# ?; F
How many mask layers it will be?3 j3 u" p$ |% d3 ?4 `0 w: }; v9 l4 V" a
Besides, ARM, any other IP, like DLL / PLL / EDRAM / USB / LVDS..... and who will be the IP provider(s), wafer Fab? design service companies? or 3rd parties? 9 J$ P( s% s8 P# lHow many chips you need? A full set mask or MPW?- R3 }0 \+ C; d! e8 M8 w. O
What package you need?
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發表於 2009-8-14 01:17:51
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