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1. Chip size. You need to know what kinds of package will be used.' v& ~/ }( {: U3 w, b k3 f1 f
2. Pad location. You need to confirm with supplier about the bond wire bonding.
6 w, ]: z5 I N3. ESD and latchup consideration.
" d1 {% D% b @: r3 Q0 b( |4. Any noisy circuit inside the circuit. If yes, you may need to isolate those noisy circuits with double guard ring or individual ground and power path.
8 ?* a- E$ R) b# u5. The current consumption on the whole circuit. It will affect the metal width of each building block and the whole circuit.3 i+ v3 s1 b: G8 G, X% h+ r+ x
6. Make sure there is no softcon connection.+ L* C" I: y0 l9 H
7. How many metal layers could be used ?* d# A* l8 h5 h" `
8. Metal Density consideration. |
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