|
|
![]() 7 p) Q$ K5 d7 P0 `4 F9 Y
Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits
2 ^6 X5 b* a1 _6 F) \" L- 美金：255.00元
- 定價：11475元
- 本商品單次購買10本10901元(95折)
- 本商品可分期付款購買 »詳情
0 [9 B: s0 c' q$ ]; Z" p
/ a7 E* E8 I. G0 U' _內容簡介5 v! z0 c( r8 W9 Z* W
5 b1 Y2 B2 Y" c
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects.
8 `7 {* Q) ^1 u) XIt begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry, before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration.
: S' p o4 e: Y5 L5 p/ \! HThe contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas. 3 T# ^5 ]) s+ T
|
|
|
IP卡
狗仔卡
發表於 2009-3-16 16:48:50
QQ好友和群
QQ空間
騰訊微博
騰訊朋友
收藏
分享
頂
踩
分享
提升卡
置頂卡
沉默卡
喧囂卡
變色卡
搶沙發
千斤頂
顯身卡
發表於 2011-3-10 08:55:41