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[經驗交流] ASIC設計工程師如何保住飯碗?

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41#
發表於 2014-6-12 10:46:55 | 只看該作者
Junior Physical Design Engineer
5 c6 [+ _0 z3 `2 M4 z/ o8 V
% H7 }. Q3 P2 O6 i公      司: famous IC company
+ K# n5 {+ }( j+ G工作地点:北京
, L$ d- W* p" F: _0 J8 [* @5 l3 {/ B, G3 ], i1 @) O9 c4 p+ Z
Position Tasks, Duties and Responsibilities
, W5 G/ x5 R  d) O! n# [The ASIC Physical Design Engineer will:
4 o2 X* m. Z* Z        Complete third party IP integration and ensure vendor guidelines are followed.
( x: Y( s& @2 M* [" U        Responsible for physical verification (DRC/LVS). 6 w1 }1 p5 V1 f
        IO ring design, fullchip floorplan.
/ |( j3 ]. O! y& L# X+ @        Block level implementation. # t8 l' \5 h9 ~5 j1 ]* o, G$ y$ [
        Work with front-end engineers to resolve problems and achieve design closure.
6 \. l" S5 y4 f% e/ x, l8 l$ h; `6 ^/ t1 K4 I7 z6 ~
Candidate Qualifications:
8 E2 R' P- R0 w/ r; J: zCandidate must:
2 o/ B+ y; @8 |        Hold BSEE (MS preferred). 1 J8 N" i& L, G4 D( j3 \) J3 _
        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification 1 `  ^- C' k5 l  ]/ V
        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC.
  i5 Y) r% Y7 O        Have the ability to independently identify and resolve design, tool, and flow problems. - `% q! }7 J- O/ P5 e
        Have related timing and physical concept.   y# c# o' G0 i. e; L2 T# ^+ z
        Be able to design and implement physical design strategies and methodologies for deep submicron designs.
) H& B( x2 \* _! G3 ]3 Z9 i# m        Familiar with EDA tools.
. @0 h; X5 F% t        Familiar with Linux environments.  
2 _- x5 R. P0 H
' {5 d: |2 G' h6 u  S" j6 e% lAny of the following is beneficial: " h6 c) b+ T" ~! O% \
        STA constraint design
7 V/ V2 `* C) r% Z  R. o2 v( B3 [       Equivalence checking ?RTL to gates, and gates to gates.
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42#
發表於 2014-6-19 09:41:01 | 只看該作者
Junior Physical Design Engineer
( V. e5 t: \3 J0 _
0 L8 P8 T+ d& t& |& V公      司:A famous IC company, i' r/ L& \+ B* \# |9 P$ Z' _
工作地点:北京8 i1 h- F  C; }, d+ c; X" D$ N4 C
% l4 e% G5 I' a* i
Position Tasks, Duties and Responsibilities   B! _& d/ ~" Y
The ASIC Physical Design Engineer will: / X2 P6 f3 ]$ U/ M8 h+ s
        Complete third party IP integration and ensure vendor guidelines are followed.
) J3 K! y$ a6 Q5 V% z        Responsible for physical verification (DRC/LVS).   B8 S* X# b4 z
        IO ring design, fullchip floorplan. . y8 ?4 u9 C  ~& W
        Block level implementation.
2 p0 Z8 [3 e: I8 F+ ^' h5 h7 P        Work with front-end engineers to resolve problems and achieve design closure. 5 U, J% r7 p# w7 b$ w% z

( o) Y! K9 w  [' C- s3 Y6 qCandidate Qualifications: 3 X2 D2 B/ Z) ?3 V
Candidate must:
: y3 m4 `( u' m  g$ U        Hold BSEE (MS preferred).
+ ]' F8 ]# }) g# U3 f        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification ! z/ e, ^8 l+ ~' \8 ^
        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC.   H- \) Z/ v# {
        Have the ability to independently identify and resolve design, tool, and flow problems. 4 u9 Z$ x4 E% u$ L1 ^
        Have related timing and physical concept. / K+ Z) P2 Y: [$ m7 }
        Be able to design and implement physical design strategies and methodologies for deep submicron designs.
+ P1 J9 R- _0 ~; }" U        Familiar with EDA tools.
/ S8 {/ K( t+ z% B) S- T- R3 `; ]        Familiar with Linux environments.  
. _- P( b- r' B9 v3 }9 N/ ~7 T% i/ l5 j
Any of the following is beneficial:
( o% v6 B* z  A* D- O3 X: z3 {        STA constraint design 4 q4 ~- C& W4 r( c9 a4 w# I
       Equivalence checking ?RTL to gates, and gates to gates.
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43#
發表於 2014-6-19 09:42:41 | 只看該作者
Sr. ASIC Design Engineer (encoder/decoder)
" Q! {6 A, n8 G$ a+ S: J5 _9 X5 p8 J' k* B& N* Y
公      司:a leading developer of advanced digital imaging solution, t* m$ a( ~% ?, S, P$ d* }7 W2 g
工作地点:上海0 Z; o1 M, S# M  f+ H( \
2 H8 b6 R6 B3 a1 j( D
Position Overview: The candidate will join a team of  highly competent ASIC designers involved in design, verification, and implementation (ASIC) of advanced platform for XX''s future generation multi-media products.   1 `: q9 M! E( F1 f4 p4 V
5 T0 y, w! u7 h( q& x9 A
主要职责 (70%) : m5 Z) w7 y  K6 A9 q% d: j
In-depth knowledge of TV encoder and decoder design. Good understanding of TV system design.  7 _) x9 v' C$ N0 F  U% e
Proficiency on digital filter algorithms and hardware implementation.
5 ?1 t) J1 \) D. ?7 T5 L# zDevelopment and verification of complex IP module, integration of the IP module into the Soc devices, top-level design handling, system level testing.
$ C4 K* G  g$ v6 W5 NParticipate in the FPGA platform development and lab debugging   
5 B6 H3 b$ v( h
9 K1 e% }* Q+ I/ t' D其他职责 (30%) 6 I$ f' Q, P" u6 }0 D+ |! @1 h
Participate in block level architecture design Assisting embedded FW development.
% C# C( z3 P9 l% s6 _职位要求
. V$ f( T- }. @/ D$ B) k7 _3 B: D岗位资格
; k9 _, I  t; m" p% w  G' q/ J经验/技能
# t! T" g3 i; n4 q1. Strong knowledge of TV technologies, knowledge of image signal process and CCTV system is a plus
$ T% s& k4 c/ F: L$ _5 E3 A* S& _2. Strong knowledge of ASIC design flow. Can define Micro-architecture of the IP module and /or sub-blocks. And able to write detailed engineering specifications. * t' ]1 q: _  I' z1 _
3. Good communication skills, especially in technical writing and reporting;
' J8 p& O% ]2 M7 g4. Self-motivated and ability to excel in a team environment.   
2 M6 `# `: J4 u9 K! h' n( t8 a
/ r$ y$ X8 E0 e4 S% C4 B教育
8 G/ b$ n( P  I; M" xMSEE/CE with 3+ years of industry experience
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44#
發表於 2014-6-20 09:03:13 | 只看該作者
Senior Digital Design Engineer* Z8 ^" r: F* w" A" j, a, F) V
# T0 E' A4 L5 c5 y! o' F5 i' u3 v
公      司:A leading semiconductor company# B/ q9 Z9 E; h  C0 L
工作地点:香港
' E8 D& @% N  z, U
, ?5 b5 ~' B$ H+ H) mJob Responsibilities: - H  j- k. w) y6 u" F  h
    Perform logic design, RTL coding, design verification, logic synthesis, DFT and static timing analysis % I! m+ ?& J2 B% P( \4 Y
    Develop verification environment and coverage closure
# x/ \" t- B) g3 I$ Q3 Q0 q* Y9 N( m    Support wafer level testing and silicon evaluation 9 [, b- s/ N' b$ ]- x7 S! T
    Prepare technical documents: }- S( d7 P" u- |" v; Y8 X9 w

. N- ?, R- C, s. l6 r+ eJob Requirements: 6 ]  |. f- y: u( j6 l/ {" c
    B.Sc or above in Electronic Engineering or equivalent. Applicants with postgraduate degree would be considered as an advantage
7 o7 t$ L7 t4 H! V4 h    5 Years or above of solid experience in one or more of the following areas: Verilog-based logic design and synthesis, constrained random    testbench with System Verilog & UVM, assertion based design verification or circuit-level SPICE simulations
- M, @) M1 M) c  x    Knowledge of SoC and embedded system.
* G- u. p. ~  |4 g# M    Knowledge of scripting languages such as Perl, TCL and Make
* t# S4 q6 m0 g' n' {    Candidate with less experience will be considered as Digital Design Engineer
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45#
發表於 2014-6-24 11:57:06 | 只看該作者
Junior Physical Design Engineer; |5 S! U( v1 }4 \2 w
公      司:A famous IC company
! m# ]/ A2 O5 q! Y. Q9 z1 ?. V工作地点:北京
" E' q8 D2 S' f- Q# `  W5 g+ o/ o+ y$ O' i& B, {
Position Tasks, Duties and Responsibilities
7 ?) A5 \0 }; }1 i7 C  s9 B2 AThe ASIC Physical Design Engineer will: ) C3 F' W/ [+ Y0 n- q# G: \
        Complete third party IP integration and ensure vendor guidelines are followed. 4 z- |+ m! z' B$ \1 {7 m5 w
        Responsible for physical verification (DRC/LVS).
. l! i, Z- b6 ]# H- w        IO ring design, fullchip floorplan. 5 u! ~8 w! Q% \- Q9 _$ g1 h6 j. Q5 n
        Block level implementation.
$ }* I' S2 |: H' q        Work with front-end engineers to resolve problems and achieve design closure.
: p3 l5 T- H4 C5 _: [
; b% I/ ^) g# A9 }1 j0 O7 t; n* ZCandidate Qualifications:
# ^, H: f- v7 G. W* [Candidate must: : K# k/ k" x/ W6 U# ]& U  s
        Hold BSEE (MS preferred). 3 k% k: S8 |  D( ~3 G
        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification 0 o% ~. h. P0 ~# [5 @; V
        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC.
; G3 b/ Y$ ?- b' P3 t$ |. u% \        Have the ability to independently identify and resolve design, tool, and flow problems.
+ }0 V, r! ~( X% C' e        Have related timing and physical concept.
, f  H- c. o# K! K6 B5 J        Be able to design and implement physical design strategies and methodologies for deep submicron designs.
0 S5 P/ N  i. g6 ^: p        Familiar with EDA tools. 7 a7 {% b( M- Y+ r6 L) j+ s( k
        Familiar with Linux environments.  & h6 E$ g6 t7 W$ G

; u# P% A  N0 h: dAny of the following is beneficial:   _, K  B" Y. O. G
        STA constraint design ) M( H& f( h1 d: d: o2 j& L' ]$ H
       Equivalence checking ?RTL to gates, and gates to gates.
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46#
發表於 2014-7-31 12:31:20 | 只看該作者
数字芯片设计工程师(DFT/综合)
5 m+ m8 O6 L1 H4 R5 [
5 f% ~4 `, U2 u, S) c公      司:A mobile chipset semiconductor company2 ]' U8 A( H  w) C$ S8 }9 G
工作地点:上海
, |/ H5 V% }- u' w  |, k$ T
4 {# q( I- D7 |& Y) Z% R3 x2 p职位描述:
% X& I! j8 v6 P+ ]0 c4 s4 L: d( S3 A1、To provide and support SYN&DFT work for several projects in parallel  
6 {9 S( |0 n' h$ j0 r2 X2、Run block level implementation for each project, include synthesis, DFT and LEC ! q4 b. y* v4 x; f
3、Support block level physical evaluation  3 j- b7 E3 h, \4 `, {6 O" S' }
4、co-work with designer and provide block level SDC file
% d9 x0 }8 Q8 W/ |6 {& M0 c/ p- M5、co-work with Back-end team for timing signoff
9 [1 x: ?9 [7 x- I5 I
6 m9 B; h0 H1 t/ o, D3 J0 d. Q职位需求: ) O) b$ W# y% ]5 A& i
1. 了解集成电路设计的基本流程 + h! {4 j, G/ w
2. 相关Synthesis, formal check 和DFT的工作经验。(3A, 3B, 3C精通一项即可)
# d0 V. t$ m* C( E4 W' \3A. 有超过2~3个项目的synthesis 经验, 用过RTL compiler且熟悉timing的相关知识  % Y4 R: L& f: {- q
3B. 有超过2~3个项目的formal check经验,熟悉CPF的low power flow ) r2 |5 d8 {5 P  W3 ~9 c$ g- g
3C. 有超过2~3个项目的DFT insertion经验, 用过Mentor DFT的优先考虑 & _7 ]7 s2 T/ Y/ M
3. 具有良好的英语阅读和书写能力。
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47#
發表於 2014-10-29 08:13:11 | 只看該作者

ASIC Corporation將展示節能、高頻寬效率的C-RAN解決方案

西班牙巴賽隆納--(美國商業資訊)--eASIC Corporation:4 \0 A/ G! s( ]  ~1 q0 Z

, w4 g2 x, d5 W0 o人物:2 ]+ Q) z% d, y; J, S0 T

: Z# [/ A" Y( [, {9 P領先的單光罩自適應ASIC設備供應商eASIC Corporation將由eASIC無線業務主管Christian Lanzani博士擔任代表,負責整體無線策略,包括無線存取、去程傳輸(fronthaul)連線、基頻處理和回程傳輸解決方案。 # ?" U" l/ E- J- X1 |3 z" f& P. P& P
7 |) I  s1 t; D( x. w
事件:1 x1 j# a- M  ]

& K0 m7 i0 p0 v* ^% \8 }$ t( G3 ]eASIC將作為聯合贊助商參加Wi-Fi世界高峰會、去程傳輸暨C-RAN高峰會(Wi-Fi World Summit & Fronthaul & C-RAN Summit),展示C-RAN去程傳輸在部署方面的挑戰,提供eASIC解決方案的細節。展示過程將包括無線存取、CPRI over OTN轉換器和基頻集區,包括L1硬體加速的使用案例。) `( N4 F1 G) m( }
! }; Q5 ]! i# O6 d5 l# [
時間:2014年10月29日,週三 8 @% X1 ^, s/ ]! S5 j' A/ N
地點:西班牙巴賽隆納赫斯珀裡亞塔樓酒店(Hesperia Tower Hotel) ( n9 M% g6 m8 E0 Y2 n  A$ {" |% U# A) b

  x1 r: T$ N- u& K3 A1 h! [+ X" T9 i如需瞭解有關eASIC Corporation的更多資訊,請造訪www.easic.com。Wi-Fi世界高峰會、去程傳輸暨C-RAN高峰會細節可以從以下網址獲得:http://wifiworldsummit.com/
5 `9 e' ?$ M3 B) h4 [* g% A
7 j" |7 R# ]  ?6 q: D' `* e  |關於eASIC  l( r0 B; ^& o* @! s" H0 }
- S2 \% K4 M" K$ Q9 H
eASIC是一家無晶圓廠半導體公司,提供突破性的單光罩自適應ASIC設備,旨在顯著降低客製化半導體設備的整體成本和縮短投產時間。使用通孔層客製路由的專利技術實現了低成本、高性能和快速周轉ASIC及單晶片系統設計。這種創新構造使eASIC能夠提供前期成本顯著低於傳統ASIC的新一代ASIC。eASIC Corporation是一家私人公司,總部位於加州聖塔克拉拉。投資人包括Khosla Ventures、Kleiner Perkins Caufield and Byers (KPCB)、Crescendo Ventures、希捷(Seagate Technology, NASDAQ:STX)和Evergreen Partners。如需eASIC的更多資訊,請造訪www.easic.com
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48#
發表於 2015-2-23 20:44:05 | 只看該作者
Asic 的利基市場和 Fpga的利基市場 各有千秋.- T0 O0 V& l% i; V" S
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49#
發表於 2015-7-23 21:32:34 | 只看該作者
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