某半導體大廠徵求Program Manager

chip123

Title Responsibilities：
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1. Coordination among module engineering, SPICE, desgin service, reliability, marketing, , and fab on the delivery of tsmc technology.
2. Responsible for technology development, characterization, qualifaication, transfer, and early customer engagement.
3. Planning, setting priority, and execution of short and long term tasks.       
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: o3 z1 b) g9 O* qRequirements：

: v. Q  x/ ]9 L+ w; h1. Minimum master degree in engineering field
2. Minimum 8 years of experiences in process integration or device engineering.
3. Candidate with design or product experience is a plus
- j' s7 Y  a  X* V$ b4. Fluent in English.
2 r& ]. [* S7 J9 @3 V5 G7 }  g5. Work location in Hsinchu, Taiwan."
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Package： around annual NT 300萬 ~700萬

! o1 X! P0 t. b8 M6 J- ?Stock：providing stock option depends on experience

意者請與 chip123@chip123.com.tw  聯絡！