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Per my experience ,Diodes + RC-Control , inverter and PowerClamp is better for out pad. v0 Y- _4 S6 }) J" Q. t' N$ F
Generally speaking ,the root cause of ESD failed is from below.( Y9 j0 {& Q8 G r; _3 z8 \
<i>clamp NMOS's ability.6 J( ]) i# X9 \; K5 v$ a
<ii>clamp NMOS's turn-on rate.( `$ d" L6 x8 v+ X
<iii>Not follow design rule.......................6 P+ O; h# H9 F0 m/ j" U
As we know ,RC-control is to keep clamp NMOS off when IC is on normal operation.(us)% M, ~1 L7 U$ ^8 l! w( e/ B2 D
When sufferred ESD pulse(ns),GGNMOS be turned on by coupling .( t; l" Y: k, A4 { q1 d2 N* e( p
If adding inverter between RC and clamp NMOS,it will speed up clamp NMOS turned on.
$ _- e O9 f, p$ I& c0 I* l4 NJust for reference !!! |
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