IC設計中前端和後端的區別!?

sophiew

高级芯片后端设计工程师
公      司：NO.277-A mobile chipset semiconductor company
, V1 N- O2 |* J3 s7 v工作地点：上海
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" P+ c" ?  d& D; \8 q' D职位描述

8 g# g9 Y2 C, A1、参与超大规模SOC芯片物理设计的全流程；
+ @# v& ^# I" d2 P9 A$ U; _0 n# y2、挑战实现业界速度最快、功耗最低的高性能SOC芯片；

职位要求

) v: p* n7 i2 l$ [& \1 x# N- H1、本科3年以上相关工作经验（硕士2年以上相关工作经验），并有实际的tapeout经验；
2、熟练掌握深亚微米后端物理设计流程；
+ F% W# u& K, G1 g5 [3、熟练使用Synopsys, Cadence或Magma等数字芯片物理设计工具；                                                                                             
' C1 c4 ?: A) J; U. R) C4、熟练使用Calibre等物理验证工具；熟练使用PT等时序验证工具；

sophiew

Staff Digital Design Engineer (Front-end)
: o. C  O, I- {2 M, m$ L公      司：A famous IC company
工作地点：上海
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Responsibilities  
Develop ARM-based MCU/SOC products  
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Mandatory Skills  
Very good at Verilog/SystemVerilog coding and simulation  
2 x3 U9 f4 _) S0 Q  @Very good knowledge of MCU architecture and C programming  
Familiar with ASIC design flow, including related tool experience and skill, including Synthesis, Timing check, power analysis, Low power design, Design for Test
Skillful in Unix/Linux shellPython/Perl script programming  
Fluency in English and good in communication skill  
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1 ^  h4 A, T1 dPreferred Skills  
ARM-Cortex M series related experience and knowledge is highly preferred  
Understanding of low power design flow  
Understanding of mixed-signal simulation  
$ e9 G& i" S4 o* A! l( b/ n4 {Understanding of embedded firmware and programming is a plus  
Knowledge of physical implementation  
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Education  
' p' q9 e0 y4 u5 T1 ^5 _4 H. m  MMaster Degree of EE or related  
# e) i+ ^# ]7 f' C9 ^  V7 YExperience  
' Z' N6 z1 J2 }3 w0 |8+ years of design experience.  
At least two years of US or Europe-based Company experience.