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Layout Guidelines for Optimized ESD Protection Diodes$ b% t: H6 @- R+ A8 `, P
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Karan Bhatia and Elyse Rosenbaum
+ T& ?1 K7 i) aDepartment of Electrical and Computer Engineering • University of Illinois at Urbana-Champaign9 J2 g( @2 _1 d/ n3 T
1308 W. Main St., Urbana, IL 61801 • Tel. +1-217-244-0578 • Fax +1-217-244-1946 • Email: ksbhatia@uiuc.edu
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Abstract - In this work, various layout options for ESD diodes’ PN junction geometry and metal routing are
0 _$ o8 ^) H4 n+ S8 ]6 winvestigated. The current compression point (ICP) is introduced to define the maximum current handling1 l i) u J$ I; l8 P. F6 r
capability of ESD protection devices. The figures-of-merit ICP/C and RON*C are used to compare the
* Y" c5 u% [/ _8 Z/ sperformance of the structures investigated herein. |
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