標題: ISE的問題...請教前輩們 [打印本頁] 作者: mclaren_18 時間: 2007-8-9 11:25 AM 標題: ISE的問題...請教前輩們 如題:0 N0 G, y& k# m( p: S% |& h
各位大大們: 6 x' L8 k" h( P0 e+ J% q請教一下 Number of bonded IOBs: 563 out of 440 127% (*) ; t- e& r+ z: Z5 V |. \( Z5 E" e我的IOB超出範圍出現以下錯誤..該如何解決啊?? 8 o% x6 f! K% O3 C , v5 q L( i/ h7 H2 N/ TERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device. 3 o) l" t5 E( H" D: b9 x R$ L6 q9 ~, c: j! }" r' S
ERROR:Map:115 - The design is too large to fit the device. Please check the* e* G) `2 g# [4 Y0 A4 d& j& _, ^" p4 @) q
Design Summary section to see which resource requirement for your design0 \7 F" m' k5 [% u: j' _# C
exceeds the resources available in the device. In particular check the * q. ~# i% R9 h non-slice resources since the slice counts may reflect the early termination 3 y, \* v0 T1 D" g of the flow.% _. N9 l/ _) n. P# ?6 I
% m2 C# ^* j0 M/ q
NOTE: An NCD file will still be generated to allow you to examine the mapped , u1 b% S! K+ B& e$ O$ f$ O design. This file is intended for evaluation use only, and will not process3 l) V9 {. B. p; f( Z1 Z
successfully through PAR.0 ^- D r9 u% w9 S9 `. y- p9 o
2 X1 u$ G8 D* n/ `) {- p7 HERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device. % r6 @. w/ p/ Q8 |0 L2 | D9 ^3 A, l* V
謝謝 作者: ssejack1 時間: 2007-8-9 01:42 PM
Device 的 IO block 只有 440 但 design 須 563 !超出了!# t; N7 o4 k- f6 Z
換較大的 package or 減少 IO 使用數量!