手機市場區隔 | Ultra Low | Entry/Mid | High-end |
多媒體/無線連結功能 | 少 5 d7 R* E3 R0 l9 P/ k | 中等 | 多 " Y$ T% }- e# g, ]! m6 Y( a2 B |
手機功能整合之技術趨勢& O: [7 \9 p5 p6 e2 i& C+ j: h | Low cost integrated solution (SoC) | SoC or SiP | SiP |
參與此市場之基頻晶片業者3 @* x) U1 j+ ]5 G! G6 B6 q8 N* B | TI (LoCosto),Infineon(EGoldRadio),NXP(Aerofone, formerly Silicon Labs') etc. | 既有手機晶片大廠(TI, Qualcomm, Freescale..etc.) | 既有手機晶片大廠(TI, Qualcomm, Freescale..etc.) |
手機基頻IC 業者類型 | IDM業者 | IC設計公司 |
一線廠 &'06 市佔率(Rev. based) | TI (30.3%) | Qualcomm (27.3%)# R; \5 P, q4 |: \2 c( k4 ]6 n |
二線廠 &'06 市佔率(Rev. based) | Freescales(11.1%), NXP(4.6%),Infineon(4.8%), Agere(2.8%), ADI (2.0%), STM | Mediatek(7.6%), Marvell(1.8%), Broadcom$ B8 j) D. S! t( l/ R' a |
特點 | I.Long standing & strong customer relationships (ex: TI with Nokia, Freescale with Motorola) II.Leading technology `$ \7 }, o0 r : [& e2 `$ Z$ G6 N6 g2 \ | I.Unlike Qualcomm (leading in CDMA & No.2 in WCDMA), others with comparatively weak customer relationships II.Marvell & Broadcom grow in multimedia(App. Processor) & connecting functionalities(like Bluetooth & Wi-Fi); r- q6 Q, U4 @; J" D* | III.Mediatek gained majority share in China market |
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