標題: 外商機會(USA)，Mechanical Engineer , Taipei,--Aug.26,2010!! [打印本頁] 作者: highspeeddesign 時間: 2010-8-26 04:50 PM 標題: 外商機會(USA)，Mechanical Engineer , Taipei,--Aug.26,2010!! 美國硬體積體電路企業高薪徵才, NASDAQ上市公司，薪水高，福利好，花紅多，還猶豫什麽，快來參加！！ / y4 Y; F( M0 \: O B/ N! n
請發送履曆或者您的問題到lowpowerdesign@hotmail.com，爲您一一解答8 t$ R8 ]" N/ T, l) D( R! l
# E9 j$ k* q. ]4 B) s% g1 A, F
XXX, the leader in designing data storage systems, is in search of a senior level Mechanical Engineer to help bring new technologies to market. The position will be responsible for the oversight of design of electronic packages for enterprise data storage systems at XXX ODM partners. The position will be required to attend internal program meetings with US based design teams and xxx Taiwan based ODM partners. It is expected that the candidate will have expertise in the application of mechanical principles which will include the application of Finite Element Analysis (FEA) tools, the ability to create technical documentation, performing tolerance analysis' and creation engineering drawings. Mechanical Engineers at xxx are required to have expertise in the design for EMI containment with the understanding of industry practices and materials. The position will require proficiency in designing for high volume hard tooling of parts to include: sheet " t( t* [8 B7 S" u; C* Umetal, injection molded plastic and diecast. 5 E- B; Z; z% l6 J$ ORequirements/Qualifications (Education) & \3 S1 s. \# e L3 o5 o- BSME with 5 to 10 years experience in the server or data storage industry T; W% U; _8 K- N( c1 e! ?- The candidate will need to possess the inter-personal skills to be able to work on crossfunctional teams both internal and with our ODM partners. He/she will be required to manage the program aspects of the project including planning, scheduling, and project reporting 5 K; G; o8 J$ Z2 A- Strong verbal and written communication skills in both English and Mandarin are required6 u% e& N+ s7 E p" W
- Design/Test expertise in the following areas a plus: EMI, Shock & Vibration, Rotational % w. H3 z7 r8 \7 c5 fVibration, Shipping Packaging, Thermal Analysis (Flow bench) and Material Sciences.